I had the chance to check out the new case lineup from FSP Group during Computex 2026, and one of the more interesting reveals was the U560 E-ATX Dual Chamber Case.

You need only take a look at the U560 to see this is not just another pretty chassis. The U560 is heavily focused on function and that is very apparent with the dual chamber design. The PSU and motherboard sections are separated which helps with heat dissipation and airflow. It’s a practical move, especially for higher end builds where thermals can easily get out of control.

Cooling is already handled out of the box with four pre-installed fans; two large 160mm units at the front and two 120mm fans at the rear. That setup alone should give builders a solid baseline without immediately needing upgrades. It’s clearly designed to move a lot of air without overcomplicating things.

Maintenance also looks straightforward. The front panel is magnetic and comes with a dust filter, so cleaning doesn’t feel like a chore. It’s one of those small quality-of-life features that actually matters over time.

Another thing worth noting is support for back-connect (BTF) motherboards. Cable management is cleaner by default, and if you’re building a showcase system, that makes a big difference without needing extra effort.

What stood out more is that FSP is still actively pushing consumer-focused products like this even with the current industry shift toward AI and enterprise hardware. While a lot of brands are leaning heavily into AI infrastructure, FSP hasn’t completely sidelined the enthusiast and gaming market.